Back to News
AI
Samsung signs a $200 billion chip deal with Broadcom covering memory, foundry and advanced packaging through 2030
The Next Web·July 25, 2026·1 min read
AI Summary
Samsung Electronics has signed a $200 billion deal with Broadcom to collaborate on memory chips, foundry manufacturing, and advanced packaging for AI semiconductors. This agreement is set to last until 2030 and highlights the growing demand for advanced technology in the AI sector.
From the source
Samsung Electronics and Broadcom have signed a memorandum of understanding worth more than $200 billion spanning memory chips, foundry manufacturing and advanced packaging for artificial intelligence semiconductors. The deal, announced on Friday at an AI summ…
The full text couldn't be loaded here (the source may require a subscription).
View original at The Next WebKeep reading
The chatbot always has an answer: Young Islamists are also radicalizing with AInordkurier.de · 1h agoSpaceX vs. Nvidia: Which Trillion-Dollar Artificial Intelligence (AI) Stock Is the Better Buy After the Recent Pullback? - The Motley Foolfool.com · 1h agoVW's Chinese subsidiary deepens AI collaboration with Horizon to accelerate autonomous driving technology developmenttopics.smt.docomo.ne.jp · 1h agoArtificial Intelligence Becomes a 'Shoulder to Lean On' and Surpasses Use for Productivity, Study Indicatesatribuna.com.br · 1h ago
Was this useful?